At the International Symposium on Photonic Packaging international experts from Germany and abroad will present the current state-of-the-art in this field and discuss technological aspects as well as market launch.

The event is open to developers and decision makers from the realms of data communication, telecommunication, medical engineering, sensor technology, and automotives.

Topics
* Roadmaps and System Requirements
* Design and Components
* System Integration and PCB Technology
* Assembly and Reliability

pfeil Program (.pdf/48KB)

pfeil Register now for Symposium and Table Top Exhibition!

Time: November 13, 2008, 9:30 am – 5:30 pm
Venue: Messe München, Hall A1, Conference Room A12
Conference language: English

Conference fees (including conference proceedings):
Speaker fee: EUR 195,-
Early bird: EUR 275,- (until October 15, 2008)
Regular: EUR 350,-

 

For further information don't hesitate to contact the conference secretariate at:

MCC Public Relations GmbH

Planufer 92d
D-10967 Berlin

Tel.: +49 (30) 61 28 86 11
Fax: +49 (30) 61 28 86 88

photonics@mcc-pr.de


 

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